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Further iPhone 5S ‘Leaks’ Reveal New A7 Chip, Dual-LED Flash, and More

Further iPhone 5S ‘Leaks’ Reveal New A7 Chip, Dual-LED Flash, and More

Following last week’s leaks (1, 2, 3) of a detailed set of supposed iPhone 5S images, which revealed a larger battery, the logic board and display components, and more, a new leak from Fantastic Fone (via MacRumors/BGR) reveals even further details. New parts in the latest images include a new front-facing camera, and a new main SoC chip model number that appears to match up with Apple’s next-gen A7 chip.



MacRumors explains some of the most interesting details of the new chip:


As seen in one photo, the chip carries an Apple model number of APL0698, suggesting that this is indeed intended to be branded as an A7 chip rather than a modification on the A6 chip found in the iPhone 5. The original A6 chip carried a model number of APL0598, with the A6X found in the fourth-generation iPad carrying an APL5598 model number, demonstrating how Apple varies the first digit for members of a given A-series family and increments the second digit when transitioning to a new family. 

Apple’s pattern of model numbers can be seen even more clearly in the A5, which has seen several different variations over its lifetime. That chip debuted with an APL0498 model number, with a later die shrink carrying an APL2498 model number. Yet another version of the A5 appeared earlier this year in a tweaked Apple TV, with that chip carrying an APL7498 model number. 

Additional markings on this new iPhone 5S chip indicate that it carries Elpida DRAM, apparently in the same 1 GB amount seen on the A6. 


As previously suspected, the chip also appears to be significantly larger than the A6 chip found in the iPhone 5 (as seen in the above shot). It’s worth noting, however, that the chip appears to be a rather early prototype manufactured in September of 2012, and that the “leaked” device in its entirety was assembled back in December. As such, it’s quite possible that it won’t reflect the final changes present in the device Apple releases later this year.


Another interesting note is that the chip may be manufactured by TSMC rather than Samsung – a manufacturing transition that has long been rumored as taking place. The new dual-LED flash also appears somewhat different than what has been shown in previous leaks.

While these are interesting revelations, to be sure, it’s important to remember that, while the images appear authentic, it’s impossible to say what Apple will ship in their finished product when the next-gen iPhone finally launches.

The “iPhone 5S” is likely to be unveiled later this year, with current rumors pointing to August or September, and is rumored to include significant under-the-hood upgrades, as well as a possible fingerprint sensor under the home button.