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Ming-Chi Kuo: Third-Gen AirPods Expected to Use System-in-Package Technology Similar to AirPods Pro

Ming-Chi Kuo: Third-Gen AirPods Expected to Use System-in-Package Technology Similar to AirPods Pro

Well-connected Apple industry analyst Ming-Chi Kuo says Apple’s third-generation AirPods will adopt compact system-in-package (SiP) similar to the company’s AirPods Pro wireless earbuds. Kuo’s prediction comes in his latest TF International Securities note (via MacRumors).

Apple is widely expected to debut new entry-level AirPods sporting a design similar to AirPods Pro in the first half of 2021.

Kuo last month predicted the AirPods 3 would use SiP technology to integrate the earbuds’ audio features into the smaller casing. AirPods Pro, introduced in November 2019, feature an in-ear design that offers three different sizes of soft, silicone tips in the box, and features shorter stems below the ear. They also offer several other improvements over the original AirPods, such as active noise cancellation, improved sound quality, and sweat/water resistance,

Kup expects current-generation AirPods Pro part suppliers to see component shipments grow an estimated 50% to 100% year-over-year. Amkor, JCET, and Huanxu Electronics will likely supply the SiP components, while Shin Zu Shing is expected to supply the ‌AirPods‌ case hinge.

The second-generation AirPods are expected to cease production when the new model debuts.

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