The Korea Herald reports that Apple’s Vision Pro headset will use a new type of dynamic random access memory, or DRAM, that has been custom designed to work with Apple’s R1 input processing chip.
The Vision Pro is powered by a pair of chips, The first is the main M2 processor that processes content, runs the visionOS operating system, executes computer vision algorithms, and provides graphical content. The R1 chip is responsible for processing the information from the headset’s 12 cameras, five sensors, and six microphones, and streams images to the displays.
To support the R1’s high-speed requirements, the headset will reportedly use a 1-gigabit low latency DRAM chip supplied by SK hynix that features an increased number of input and output pins to minimize delays.
As noted by MacRumors, the chip is also said to utilize a unique packaging method called Fan-Out Wafer Level Packaging, which enables it to be attached to the R1 chipset as a single integrated unit, allowing for a doubling in processing speed.
Apple’s $3,500 headset is set to go on sale early next year.
