Apple chipmaker Taiwan Semiconductor Manufacturing Company Limited (TSMC) has unveiled its next-generation A14 process node at the North America Technology Symposium. The 1.4nm process will enter planne dproduction in 2028.
The highly-advanced process will create chips that will likely be used in future generations of Apple Silicon. The A14 promises impressive advances over TSMC’s N2 node, including up to 15% faster performance at the same power or up to 30% power savings at the same performance. A14 also boasts over 20% logic density improvement.
TSMC also said that it is also evolving its TSMC NanoFlex standard cell architecture to NanoFlex Pro, enabling greater performance, power efficiency, and design flexibility. From the company’s press release:
“Our customers constantly look to the future, and TSMC’s technology leadership and manufacturing excellence provides them with a dependable roadmap for their innovations,” said TSMC Chairman and CEO Dr. C.C. Wei. “TSMC’s cutting-edge logic technologies like A14 are part of a comprehensive suite of solutions that connect the physical and digital worlds to unleash our customers’ innovation for advancing the AI future.”
While TSMC didn’t specify which of its many clients will benefit first from the new 1.4nm chips, but it’s a good bet that Apple will be at the front of the line when orders are being taken.
