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Chipworks iPhone 7 Teardown Offers a Closer Look at Logic Board Components

Chipworks iPhone 7 Teardown Offers a Closer Look at Logic Board Components

Chipworks, which shares a teardown fetish with iFixit, has torn apart an iPhone 7, and has offered up a closer look at the chips and such that are on the device’s logic board.

Chipworks iPhone 7 Teardown Offers a Closer Look at Logic Board Components

The chip receiving the most examination love, is the A10 Fusion chip, which is the heart of the new iPhone 7 and iPhone 7 Plus handsets. The chip, fabricated by Taiwanese chipmaker TSMC, has a die size of 125 square millimeters, and is “incredibly thin,” due in part to the InFO packaging technique used by TSMC, which proved to be a major factor in TSMC winning an exclusive contract to manufacture the A10 Fusion.

Chipworks iPhone 7 Teardown Offers a Closer Look at Logic Board Components

The new iPhone includes 2GB of Samsung K3RG1G10CM LPDDR4 memory, (compared to the iPhone 7 Plus and its 3GB of RAM, needed to deal with the dual lense camera on the Plus).

The cellular modem is an Intel XMM7360, paired with two SMARTi 5 RF transceiver chips and a power management chip, also from Intel. Apple is producing two models of both the 7 and 7 Plus, one of which is made for AT&T and T-Mobile users which does not include support for CDMA networks. The Qualcomm chips in Verizon and Sprint models can support both CDMA and GSM models.

The back-facing camera in the iPhone 7 is a single lens 12MP affair, lacking the extra lens of it’s bigger brother. The front-facing shooter is the same improved FaceTime HD shooter as seen in the Plus.

For more details of the Chipworks iPhone 7 teardown, visit the Chipworks website.

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